Kiss-Cut Module

With low weight and short strokes/quick tool lifts, this module offers very high cutting speeds. The module also impresses with simple operation, rapid tool changes, and very high precision.

Depending on the application, you can choose between two different processing modes: in pressure mode, the module exerts constant pressure, adjustable from 30 to 1,500 grams, on the substrate. This results in precise, clean cuts in e.g. pressure-sensitive vinyl without damage to the liner material. In position mode, the tool through-cuts the material at a pre-set depth.

  • Kiss-cutting and through-cutting of all commonly used vinyls, films, etc.
  • Clean, precise cutting of self-adhesive vinyl without damage to liner
  • Compatible with S3
Product information

Any type of vinyl or film