Kiss-Cut Module - KCM-S
Because of the low weight and minimal stroke of this module, the KCM-S offers very high processing speeds. The module also impresses with simple operation, fast tool changes and very high precision.
Depending on the application, you can choose between two different processing modes: In pressure mode, the module exerts constant, user-definable pressure on the substrate, ranging from 30 to 1600 grams. This leads to precise, clean cuts in e.g. pressure-sensitive vinyl without damage to the liner material. In position mode, the tool through-cuts the material to a set depth.
Advantages at a glance
- Kiss-cutting and through-cutting of all common pressure-sensitive films, vinyl, etc.
- Clean, precise cuts without damage to liner
- Compatible with S3